High Quality BGA Reballing Stencil QU:5 for Qualcomm SDM670/710/845/MSM8917/SM6150/8150/CPU Phone Repair Tools ► Photo 1/1

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Specifications

  • Type: Hand Tool Parts
  • Origin: CN(Origin)
  • Material: STAINLESS STEEL
  • Brand name: easy100fix
  • model: QU 5
  • diameter: 0.12MM

High Quality BGA Reballing Stencil QU:5 for Qualcomm SDM670/710/845/MSM8917/SM6150/8150/CPU Phone Repair Tools

Seller:
Alitools rating:
90%
/
Aliexpress rating:
100%
4.32 $
40   orders
/
7   reviews
Rating: 5

Price history

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