Amaoe BGA Reballing Stencil Solder Tin For SAMSUNG S7/S7+ G9300/G9350/G930F Exynos 8890/MSM8996 CPU RAM WIFI POWER Chip ► Photo 1/1

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Specifications

  • Type: Other
  • Model Number: Amaoe BGA Reballing Stencil
  • is_customized: No
  • Material: STAINLESS STEEL
  • Usage: Commercial Manufacture
  • Thickness: 0.12MM

Amaoe BGA Reballing Stencil Solder Tin For SAMSUNG S7/S7+ G9300/G9350/G930F Exynos 8890/MSM8996 CPU RAM WIFI POWER Chip

Seller:
Alitools rating:
85%
/
Aliexpress rating:
60%
5.25 $
3   orders
/
2   reviews
Rating: 3

Price history

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