25000pcs/bottle 0.2-0.65mm BGA Reballing Balls Leaded For IC Chip Soldering Accessories Solder Ball Tin Material Sn63/Pb37 Rewor ► Photo 1/6
25000pcs/bottle 0.2-0.65mm BGA Reballing Balls Leaded For IC Chip Soldering Accessories Solder Ball Tin Material Sn63/Pb37 Rewor ► Photo 1/6
25000pcs/bottle 0.2-0.65mm BGA Reballing Balls Leaded For IC Chip Soldering Accessories Solder Ball Tin Material Sn63/Pb37 Rewor ► Photo 2/6
25000pcs/bottle 0.2-0.65mm BGA Reballing Balls Leaded For IC Chip Soldering Accessories Solder Ball Tin Material Sn63/Pb37 Rewor ► Photo 3/6

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Specifications

  • Model Number: Solder Ball
  • Particle Size: 1-10μm
  • Balls League: Sn63 / Pb37
  • Standard: RoHs Available & SGS Tested
  • Quantity: 25,000 PCS per Bottle
  • Feature 1: Rework Repair Tools
  • Feature 2: BGA Reballing Balls
  • Feature 3: Reballing Balls
  • Date: 09-17

25000pcs/bottle 0.2-0.65mm BGA Reballing Balls Leaded For IC Chip Soldering Accessories Solder Ball Tin Material Sn63/Pb37 Rewor

Seller:
Alitools rating:
80%
/
Aliexpress rating:
96%
1.50 2.29 $
2867   orders
/
614   reviews
Rating: 4.8

Price history

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Customer Reviews

G***l
February 6, 2021

The balls look OK, have not tried them yet.

Anonymous
February 5, 2021

perfect transaction, good quality, thank you

Anonymous