AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template ► Photo 1/4
AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template ► Photo 1/4
AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template ► Photo 2/4
AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template ► Photo 3/4

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Specifications

  • Model Number: Qualcomm BGA Reballing Stencil
  • Particle Size: 1-10μm
  • Type: Reballing stencil
  • Application:: BGA rework station accessory
  • Function:: Reballing Assistant
  • Thickness: 0.12mm

AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template

Seller:
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225.66 $
3   orders
/
2   reviews
Rating: 5

Price history

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Customer Reviews

P***r
November 22, 2020

As described. Thank you very much!

P***r
November 22, 2020

As described. Thank you very much!