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Specifications
- Model Number: Qualcomm BGA Reballing Stencil
- Particle Size: 1-10μm
- Type: Reballing stencil
- Application:: BGA rework station accessory
- Function:: Reballing Assistant
- Thickness: 0.12mm
AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template
225.66
$
3
orders
/
2
reviews
Price history
- for 3 month
- for half a year
- Requires Alitools extension
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Price drop notification
214.38 $ (-5%)
214.38 $ (-5%)
203.09 $ (-10%)
191.81 $ (-15%)
180.53 $ (-20%)
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Customer Reviews
P***r
November 22, 2020
As described. Thank you very much!
P***r
November 22, 2020
As described. Thank you very much!