AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template ► Photo 1/4

AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template ► Photo 1/4

AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template ► Photo 2/4

AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template ► Photo 3/4

Photos of buyers

Specifications

Model Number: Qualcomm BGA Reballing Stencil
Particle Size: 1-10μm
Type: Reballing stencil
Application:: BGA rework station accessory
Function:: Reballing Assistant
Thickness: 0.12mm

Tools Welding & Soldering Supplies Welding Fluxes

AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template

Alitools rating:

85%

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Aliexpress rating:

100%

Read reviews and get in touch with the seller. If everything looks good, proceed with the purchase.

The seller has been active on the platform for more than three years.
Buyers are satisfied with the seller's communication.
The products from the seller match their descriptions.
The seller ships quickly.
5% buyers are dissatisfied with products from the seller.

225.66 $

3 orders

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2 reviews

Rating: 5

Price history

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Customer Reviews

P***r

November 22, 2020

As described. Thank you very much!

P***r

November 22, 2020

As described. Thank you very much!