Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net ► Photo 1/1

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Specifications

  • Type: Other
  • Model Number: Amaoe BGA Reballing Stencil
  • is_customized: No
  • Material: STAINLESS STEEL
  • Usage: Commercial Manufacture
  • Thickness: 0.12MM

Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net

Seller:
Alitools rating:
85%
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Aliexpress rating:
98%
5.91 $
143   orders
/
78   reviews
Rating: 4.9

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