MECHANIC Leaded BGA Reballing Balls 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm Sn63/Pb37 For BGA Rework Repair ► Photo 1/3
MECHANIC Leaded BGA Reballing Balls 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm Sn63/Pb37 For BGA Rework Repair ► Photo 1/3
MECHANIC Leaded BGA Reballing Balls 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm Sn63/Pb37 For BGA Rework Repair ► Photo 2/3
MECHANIC Leaded BGA Reballing Balls 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm Sn63/Pb37 For BGA Rework Repair ► Photo 3/3

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Specifications

  • Material: Tin
  • Diameter: 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm
  • Model Number: solder tin
  • Application: Circuit boards welding
  • Application: Mobile Phone Repair
  • Lead (Pb): 37%
  • Sn content: 63%

MECHANIC Leaded BGA Reballing Balls 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm Sn63/Pb37 For BGA Rework Repair

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3.60 4.20 $
80   orders
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22   reviews
Rating: 4.9

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