1PC 25K Tin Leaded BGA Reballing Balls 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm for BGA reballing Stencils reapir kit ► Photo 1/6
1PC 25K Tin Leaded BGA Reballing Balls 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm for BGA reballing Stencils reapir kit ► Photo 1/6
1PC 25K Tin Leaded BGA Reballing Balls 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm for BGA reballing Stencils reapir kit ► Photo 2/6
1PC 25K Tin Leaded BGA Reballing Balls 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm for BGA reballing Stencils reapir kit ► Photo 3/6

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Specifications

  • Origin: CN(Origin)
  • Application: BGA reballing
  • Melting Point: leaded
  • Material: Tin
  • Diameter: 0.20-0.76mm
  • Model Number: 25K
  • Weight: 0.01KG
  • Flux Content: 20%

1PC 25K Tin Leaded BGA Reballing Balls 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm for BGA reballing Stencils reapir kit

Seller:
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2.88 $
685   orders
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252   reviews
Rating: 4.7

Price history

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Customer Reviews

C***n
January 11, 2021

I do not recommend. I did not receive this order

D***n
May 28, 2020

The product has arrived and looks ok. I didn't test it.

Anonymous