Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template ► Photo 1/6
Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template ► Photo 1/6
Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template ► Photo 2/6
Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template ► Photo 3/6

Photos of buyers

103 more
photos

Specifications

  • Brand Name: NoEnName_Null
  • Model Number: BGA Reballing Stencil Kits
  • Particle Size: 1-10μm
  • application: for HUAWEI BGA Reballing Stencil Kits
  • application 2: for XIAOMI BGA Reballing Stencil Kits
  • application 3: for OPPO BGA Reballing Stencil Kits
  • application 4: for Meizu BGA Reballing Stencil Kits
  • application 5: for LG BGA Reballing Stencil Kits
  • application 6: for Samsung MTK BGA Reballing Stencil Kits
  • application 7: for ic power BGA

Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template

Seller:
Alitools rating:
90%
/
Aliexpress rating:
98%
6.31 28.43 $
80   orders
/
17   reviews
Rating: 4.9

Price history

Price drop notification

Out telegram bot will notify you once the price drops to the desirable one

Customer Reviews

O***i
December 31, 2020

ÜRÜNLER KALİTELİ. KARGO ÇOK HIZLI.

C***r
December 22, 2020

Very good product and fast delivery.

Anonymous