Photos of buyers
Specifications
- Brand Name: NoEnName_Null
- Model Number: BGA Reballing Stencil Kits
- Particle Size: 1-10μm
- application: for HUAWEI BGA Reballing Stencil Kits
- application 2: for XIAOMI BGA Reballing Stencil Kits
- application 3: for OPPO BGA Reballing Stencil Kits
- application 4: for Meizu BGA Reballing Stencil Kits
- application 5: for LG BGA Reballing Stencil Kits
- application 6: for Samsung MTK BGA Reballing Stencil Kits
- application 7: for ic power BGA
Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template
6.31
–
28.43
$
80
orders
/
17
reviews
Price history
- for 3 month
- for half a year
- Requires Alitools extension
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Price drop notification
5.99 $ (-5%)
5.99 $ (-5%)
5.68 $ (-10%)
5.36 $ (-15%)
5.05 $ (-20%)
Out telegram bot will notify you once the price drops to the desirable one
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Customer Reviews
O***i
December 31, 2020
ÜRÜNLER KALİTELİ. KARGO ÇOK HIZLI.
C***r
December 22, 2020
Very good product and fast delivery.
Anonymous