Kaisi 0.12mm BGA Reballing Stencil Kit Set Solder Template for iPhone IC CPU A8A9A10A11A12A13 11Pro/Max XS XR 8 8P 7P 6S 6P 5S ► Photo 1/6
Kaisi 0.12mm BGA Reballing Stencil Kit Set Solder Template for iPhone IC CPU A8A9A10A11A12A13 11Pro/Max XS XR 8 8P 7P 6S 6P 5S ► Photo 1/6
Kaisi 0.12mm BGA Reballing Stencil Kit Set Solder Template for iPhone IC CPU A8A9A10A11A12A13 11Pro/Max XS XR 8 8P 7P 6S 6P 5S ► Photo 2/6
Kaisi 0.12mm BGA Reballing Stencil Kit Set Solder Template for iPhone IC CPU A8A9A10A11A12A13 11Pro/Max XS XR 8 8P 7P 6S 6P 5S ► Photo 3/6

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Specifications

  • Model Number: BGA Reballing Stencil
  • Particle Size: 1-10μm
  • model: for iPhone
  • application: iPhone 6 6S 7 8 X 11pro A8 A9 A10 A11 A12 A13
  • application 3: bga reballing stencil kit
  • application 4: bga reballing stencil kit for iphone

Kaisi 0.12mm BGA Reballing Stencil Kit Set Solder Template for iPhone IC CPU A8A9A10A11A12A13 11Pro/Max XS XR 8 8P 7P 6S 6P 5S

Seller:
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5.67 21.77 $
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