Amaoe BGA Reballing Stencil For Qualcomm CPU RAM Chip IC SDM710 SM6150 MSM8917 SDM845 SM8150 SDM670 BGA Reballing Template ► Photo 1/1

Specifications

  • Type: Other
  • Model Number: Amaoe BGA Reballing Stencil
  • is_customized: No
  • Material: STAINLESS STEEL
  • Usage: Commercial Manufacture
  • Thickness: 0.12mm

Amaoe BGA Reballing Stencil For Qualcomm CPU RAM Chip IC SDM710 SM6150 MSM8917 SDM845 SM8150 SDM670 BGA Reballing Template

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4.51 8.76 $
5   orders
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2   reviews
Rating: 5

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