1 Bottle BGA Reballing Balls 0.2-0.65mm Leaded For IC Chip Soldering Accessories Tin Material Sn63/Pb37 Rework Repair Tools ► Photo 1/6
1 Bottle BGA Reballing Balls 0.2-0.65mm Leaded For IC Chip Soldering Accessories Tin Material Sn63/Pb37 Rework Repair Tools ► Photo 1/6
1 Bottle BGA Reballing Balls 0.2-0.65mm Leaded For IC Chip Soldering Accessories Tin Material Sn63/Pb37 Rework Repair Tools ► Photo 2/6
1 Bottle BGA Reballing Balls 0.2-0.65mm Leaded For IC Chip Soldering Accessories Tin Material Sn63/Pb37 Rework Repair Tools ► Photo 3/6

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Specifications

  • Model Number: Solder Ball
  • Particle Size: 1-10μm
  • Balls League:: Sn63 / Pb37
  • Standard:: RoHs Available & SGS Tested
  • Quantity:: 25,000 PCS per Bottle
  • Feature 1: Reballing Balls
  • Feature 2: Welding Fluxes
  • Feature 3: Solder Ball
  • Feature 4: Tin Material
  • Feature 5: Rework Repair Tools

1 Bottle BGA Reballing Balls 0.2-0.65mm Leaded For IC Chip Soldering Accessories Tin Material Sn63/Pb37 Rework Repair Tools

Seller:
Alitools rating:
84%
/
Aliexpress rating:
88%
1.43 2.12 $
4   orders
/
5   reviews
Rating: 4.4

Price history

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Customer Reviews

R***a
December 24, 2020

Thanks.

Anonymous
November 11, 2020

the container is super small. I will try how it works.

Anonymous