Photos of buyers
Specifications
- Application: PCB boards
- Melting Point: 183 degrees Celsius
- Material: Tin
- Diameter: 0.25-0.76
- Model Number: 0.25 0.3 0.4 0.5 0.6 0.76
- Weight: 0.05
- Flux Content: 63%
BGA solder ball leaded tin beads Ingredients Sn63/Pb37 Connect semiconductor wafers and circuit boards and PCB boards
0.44
–
1.84
$
67
orders
/
12
reviews
Price history
- for 3 month
- for half a year
- Requires Alitools extension
The Alitools extension is required to keep track of an item and receive notifications when prices drop.
Price drop notification
0.42 $ (-5%)
0.42 $ (-5%)
0.40 $ (-10%)
0.37 $ (-15%)
0.35 $ (-20%)
Out telegram bot will notify you once the price drops to the desirable one