Photos of buyers
Specifications
- Material: Tin
- Diameter: 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm
- Model Number: solder tin
- Application: Circuit boards welding
- Application: Mobile Phone Repair
- Lead (Pb): 37%
- Sn content: 63%
1 Bottle BGA Reballing Balls 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm leaded Solder Ball For BGA Rework Repair Tool
2.50
–
2.70
$
16
orders
/
3
reviews
Price history
- for 3 month
- for half a year
- Requires Alitools extension
The Alitools extension is required to keep track of an item and receive notifications when prices drop.
Price drop notification
2.38 $ (-5%)
2.38 $ (-5%)
2.25 $ (-10%)
2.13 $ (-15%)
2.00 $ (-20%)
Out telegram bot will notify you once the price drops to the desirable one
