Qwin Leaded BGA Reballing Ball 250K 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7mm Solder Ball for IC Chip BGA Rework Repair ► Photo 1/6
Qwin Leaded BGA Reballing Ball 250K 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7mm Solder Ball for IC Chip BGA Rework Repair ► Photo 1/6
Qwin Leaded BGA Reballing Ball 250K 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7mm Solder Ball for IC Chip BGA Rework Repair ► Photo 2/6
Qwin Leaded BGA Reballing Ball 250K 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7mm Solder Ball for IC Chip BGA Rework Repair ► Photo 3/6

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Specifications

  • Model Number: Qwin Lead Bga Reballing Ball
  • Particle Size: 1-10μm
  • Quantities: Lead 250K

Qwin Leaded BGA Reballing Ball 250K 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7mm Solder Ball for IC Chip BGA Rework Repair

Seller:
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11.99 31.99 $
439   orders
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167   reviews
Rating: 5

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Customer Reviews

e***n
November 13, 2020

Great price, very fast shipping, A++ seller.