250k/bottle Sn63Pb37 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm BGA Solder Balls For PCB Chips Motherboard Repair ► Photo 1/6
250k/bottle Sn63Pb37 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm BGA Solder Balls For PCB Chips Motherboard Repair ► Photo 1/6
250k/bottle Sn63Pb37 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm BGA Solder Balls For PCB Chips Motherboard Repair ► Photo 2/6
250k/bottle Sn63Pb37 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm BGA Solder Balls For PCB Chips Motherboard Repair ► Photo 3/6

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Specifications

  • Origin: CN(Origin)
  • Application: 0.2mm~0.76mm
  • Melting Point: -
  • Material: Tin
  • Diameter: 0.2mm~0.76mm
  • Model Number: quwin
  • Weight: 0.2kg-0.5kg
  • Flux Content: 250K

250k/bottle Sn63Pb37 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm BGA Solder Balls For PCB Chips Motherboard Repair

Seller:
Alitools rating:
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88%
14.06 181.58 $
22   orders
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7   reviews
Rating: 4.4

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