250k/bottle Sn63Pb37 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm BGA Solder Balls For PCB Chips Motherboard Repair ► Photo 1/6

250k/bottle Sn63Pb37 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm BGA Solder Balls For PCB Chips Motherboard Repair ► Photo 1/6

250k/bottle Sn63Pb37 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm BGA Solder Balls For PCB Chips Motherboard Repair ► Photo 2/6

250k/bottle Sn63Pb37 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm BGA Solder Balls For PCB Chips Motherboard Repair ► Photo 3/6

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Specifications

Origin: CN(Origin)
Application: 0.2mm~0.76mm
Melting Point: -
Material: Tin
Diameter: 0.2mm~0.76mm
Model Number: quwin
Weight: 0.2kg-0.5kg
Flux Content: 250K

Tools Welding & Soldering Supplies Welding Wires

250k/bottle Sn63Pb37 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm BGA Solder Balls For PCB Chips Motherboard Repair

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83%

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88%

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14.06 – 181.58 $

22 orders

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7 reviews

Rating: 4.4

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