Specifications
- Model Number: Universail BGA Reballing Stencil
- Particle Size: 1-10μm
- Type: Reballing stencil
- Application:: BGA rework station accessory
- Function:: Reballing Assistant
- Design: with heat dissipating holes
- Thickness: 0.12mm
Mechanic Universal BGA Stencil for MTK Qualcomm Speadtrum Android CPU Power Supply Series Reballing Stencil Solder Template
5.68
–
12.39
$
1
orders
Price history
- for 3 month
- for half a year
- Requires Alitools extension
The Alitools extension is required to keep track of an item and receive notifications when prices drop.
Price drop notification
5.40 $ (-5%)
5.40 $ (-5%)
5.11 $ (-10%)
4.83 $ (-15%)
4.54 $ (-20%)
Out telegram bot will notify you once the price drops to the desirable one
