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Specifications
- Brand Name: NoEnName_Null
- Model Number: 138C/183C/260C
- Particle Size: 5-15μm
- Storage environment: room temperature/cold
- Suitable for1: For iphoneX Circuit Board P
- Suitable for2: Repair mainboard Location
- Type: For iphoneX Special solder paste
- Melting Point: 138/183/260
- DIY Type: Computer, Phone Chip Reballing
- 100%: High Quality
- Usage: PCB BGA Repairing Tool
- Features 1: High Viscosity No-clean Flux
- Features 2: Avoid the Pale Yellow Residue
- Features 3: Avoid the Pale Yellow Residue
- Drop Ship: Support
- Item Name: BGA Soldering Tin Cream
- weight: 55g
Lead-free solder paste maintenance soldering tin for iPhone BGA 138 183 260 degrees environmental protection tin mud CPU tin55g
4.06
–
6.16
$
70
orders
/
16
reviews
Price history
- for 3 month
- for half a year
- Requires Alitools extension
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Price drop notification
3.86 $ (-5%)
3.86 $ (-5%)
3.65 $ (-10%)
3.45 $ (-15%)
3.25 $ (-20%)
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Customer Reviews
Y***
January 14, 2021
Nice and accurate but did not test it yet but they looked solid. Thanks
K***t
January 8, 2021
The item as described. Delivery over 6 weeks delayed in relation to the chosen delivery method.
Anonymous