High quality BGA reballing stencil for Qualcomm SDM632/SDM450/MSM8953 CPU stencil for Solve capacitor adsorption tin ► Photo 1/3
High quality BGA reballing stencil for Qualcomm SDM632/SDM450/MSM8953 CPU stencil for Solve capacitor adsorption tin ► Photo 1/3
High quality BGA reballing stencil for Qualcomm SDM632/SDM450/MSM8953 CPU stencil for Solve capacitor adsorption tin ► Photo 2/3
High quality BGA reballing stencil for Qualcomm SDM632/SDM450/MSM8953 CPU stencil for Solve capacitor adsorption tin ► Photo 3/3

Specifications

  • Type: Hand Tool Parts
  • Origin: CN(Origin)
  • Material: STAINLESS STEEL
  • Brand name: easy100fix
  • model: MSM8953
  • diameter: 0.12MM

High quality BGA reballing stencil for Qualcomm SDM632/SDM450/MSM8953 CPU stencil for Solve capacitor adsorption tin

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4.32 $
1   orders
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1   reviews
Rating: 5

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