RELIFE F-20 BGA Advanced Hydrogenated Solder Paste Flux 10CC No-Clean Solder Paste Flux For Mobile Motherboard Repair ► Photo 1/6
RELIFE F-20 BGA Advanced Hydrogenated Solder Paste Flux 10CC No-Clean Solder Paste Flux For Mobile Motherboard Repair ► Photo 1/6
RELIFE F-20 BGA Advanced Hydrogenated Solder Paste Flux 10CC No-Clean Solder Paste Flux For Mobile Motherboard Repair ► Photo 2/6
RELIFE F-20 BGA Advanced Hydrogenated Solder Paste Flux 10CC No-Clean Solder Paste Flux For Mobile Motherboard Repair ► Photo 3/6

Specifications

  • Origin: CN(Origin)
  • Model Number: SK-216
  • Particle Size: 20-38μm
  • package: case
  • color: white
  • usage: mobile repair
  • Weight: 10CC
  • Model Number: F-20

RELIFE F-20 BGA Advanced Hydrogenated Solder Paste Flux 10CC No-Clean Solder Paste Flux For Mobile Motherboard Repair

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3.50 $
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