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Specifications
- Brand Name: MECHANIC
- Model Number: Rma-223
- Particle Size: 25-48μm
- Item Name: PCB BGA Solder Paste Flux
- Application: for Phone PCB BGA PGA Reworking
- Function: for Soldering, Reballing of Computer, Phone Chips
- Feature 1: High Viscosity No-clean Flux
- Feature 2: High Viscosity
- Feature 3: Good insulation avoid the pale yellow residue
- Feature 4: Good Immersion, High Intensity Joint
- Feature 5: New Type, High Quality
- Feature 6: Solder Flux Paste
- Feature 7: Phone IC Chips Repair Tool
- Length of Booster: 95mm
- Dimension: 93 x 33 x 23mm
- Volume: 10CC
- With Needle Tip: Yes
- With Booster: Yes
Original AMTECH RMA-223-UV BGA Solder Paste Flux for Mobile Phone BGA Reballing Soldering paste flux Advanced SMT Solder Paste
5 568.00
–
6 354.00
$
16
orders
/
4
reviews
Price history
- for 3 month
- for half a year
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Customer Reviews
s***n
December 21, 2020
Great Quality best prices, best service Best seller! A Will definitely buy again
J***e
October 28, 2020
Very Nice Quality Flux Thank You Seller..
Anonymous