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Specifications
- Model Number: XG-50
- Particle Size: 20-38μm
- Item Name: AMTECH Unleaded Soldering Flux
- Color: Transparent
- Material: Lead Free Tin Solder Paste
- Function: Electronics Welding
- Application: for Phone BGA Reballing
- Type 2: Lead-free Solder Paste
- Volume: 10CC
- Feature 1: Lead Free, Environmental-Friendly
- Flux: NC-559-ASM
- Usage: for Phone Welding Tool
- Features 2: Transparent Residue, No Halogen
- Design: Needle-Tube
- With Syringe Push: Yes
- Length of Syringe Push: 95mm
- Color of Syringe Push: White
- Features 3: Low Solder Ball Rate
- Features 4: Excellent Wetting Ability On PCB
- Packing: Bag
- Drop Ship: Support
Original AMTECH NC-559-ASM BGA Soldering Tin Cream for Mobile Phone Motherboard Soldering Repair Tool
147.73
–
236.60
$
3
orders
/
4
reviews
Price history
- for 3 month
- for half a year
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Customer Reviews
D***r
January 23, 2021
Goods received after 2 month shipping time, well packaged, without any damage. It is all ok.
J***k
January 19, 2021
Delivered 19. 01. 2021. Flux expiration 11/2020.......
Anonymous