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Specifications
- Brand Name: NoEnName_Null
- Model Number: NC-559-ASM-UV
- Particle Size: 25-48μm
- Application: For Phone PCB BGA PGA Reworking
- Feature 1: High Viscosity No-clean Flux
- Feature 2: High Viscosity
- Feature 3: Good insulation avoid the pale yellow residue
- Feature 4: Good Immersion, High Intensity Joint
- Feature 5: New Type, High Quality
- Feature 6: Solder Flux Paste
- Feature 7: Phone IC Chips Repair Tool
- Length of Booster: 95mm
- Dimension: 93 x 33 x 23mm
- Volume: 10CC
- With Needle Tip: Yes
- With Booster: Yes
No-Clean Solder Soldering Paste Flux RMA-223-UV Welding Flux for Mobile Phone Soldering BGA SMD PGA PCB Repair oil
3.37
–
3.87
$
4
orders
/
6
reviews
Price history
- for 3 month
- for half a year
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3.20 $ (-5%)
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2.86 $ (-15%)
2.70 $ (-20%)
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Customer Reviews
Z***a
January 2, 2021
I have tried it with my worst tin, and this flux made it easy to handle.
A***m
December 29, 2020
As per description fast delivery
Anonymous