Newest RL-404 Lead-free Low Temperature Melting Point 138° C Degrees Tin Paste Mobile phone PCB BGA/SMD Template Repair Tin ► Photo 1/6
Newest RL-404 Lead-free Low Temperature Melting Point 138° C Degrees Tin Paste Mobile phone PCB BGA/SMD Template Repair Tin ► Photo 1/6
Newest RL-404 Lead-free Low Temperature Melting Point 138° C Degrees Tin Paste Mobile phone PCB BGA/SMD Template Repair Tin ► Photo 2/6
Newest RL-404 Lead-free Low Temperature Melting Point 138° C Degrees Tin Paste Mobile phone PCB BGA/SMD Template Repair Tin ► Photo 3/6

Specifications

  • Origin: CN(Origin)
  • Model Number: RL-404
  • Particle Size: 1-10μm
  • Melting Point: 138
  • Weight: 40G
  • Material: Tin

Newest RL-404 Lead-free Low Temperature Melting Point 138° C Degrees Tin Paste Mobile phone PCB BGA/SMD Template Repair Tin

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