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Specifications
- Model Number: XG-Z40
- Particle Size: 25-48μm
- Item Name: BGA Soldering Tin Cream
- Design: Needle Tube
- Alloy: Sn63/Pb37
- Color: Colorless Transparent
- Type 2: BGA Soldering Paste
- Model 2: Dispenser Needle Solder
- Product: XG-Z40
- Microns: 25-45um
- Application: for Phone PCB BGA Soldering Tools
- Usage: PCB BGA Repairing Tool
- Function: for Phone Circuit Board SMT Welding
- Features 1: Squeeze Tube /Plunger Dispenser
- Features 2: Sticky, Durable, Easy to Replace
- Features 3: No False Welding Phenomenon
- Suitable for: Phone, Computer Repair Industry
- Material: Soldering Paste Cream
- 100%: High Quality
- Drop Ship: Support
- Origin: ShenZhen, China
- Condition: New, Unused
Mechanic Solder Tin Paste XG-Z40 10cc Syringe Solder Paste Tin Cream Welding Solder BGA Flux for Phone Welder Repair Rework
3.64
$
73
orders
/
1
reviews
Price history
- for 3 month
- for half a year
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2.91 $ (-20%)
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Customer Reviews
D***n
January 2, 2021
Object received in good order. Thank's. Happy New Year.
M***n
November 23, 2020
As described works well.
Anonymous