MECHANIC Solder Paste Flux  Melting Point 183C Tin Sn63/Pb67 for Soldering Iron Circuit Board SMT SMD BGA Repair Welding Fluxes ► Photo 1/6
MECHANIC Solder Paste Flux  Melting Point 183C Tin Sn63/Pb67 for Soldering Iron Circuit Board SMT SMD BGA Repair Welding Fluxes ► Photo 1/6
MECHANIC Solder Paste Flux  Melting Point 183C Tin Sn63/Pb67 for Soldering Iron Circuit Board SMT SMD BGA Repair Welding Fluxes ► Photo 2/6
MECHANIC Solder Paste Flux  Melting Point 183C Tin Sn63/Pb67 for Soldering Iron Circuit Board SMT SMD BGA Repair Welding Fluxes ► Photo 3/6

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Specifications

  • Model Number: M003
  • Particle Size: 25-48μm
  • Product Number: XG30 & XGSP30 & XG40 & XGSP40 & XG50 & XGSP50 & XGSP80 & XGZ40
  • Type: Welding tin paste
  • Melting Point: 183 degrees Celsius
  • SnContent: 63.0%
  • Pb Content: 37.0%
  • Feature: No-clean
  • Stored Temperature: 0-10 degrees Celsius
  • Application: For industrial use only
  • Gross Weight: About 16.0-60.0g/pcs

MECHANIC Solder Paste Flux Melting Point 183C Tin Sn63/Pb67 for Soldering Iron Circuit Board SMT SMD BGA Repair Welding Fluxes

Seller:
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Aliexpress rating:
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2.08 4.28 $
1114   orders
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111   reviews
Rating: 4

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Customer Reviews

d***n
February 13, 2021

Thank you

D***i
February 5, 2021

Not much of pasta

Anonymous