LY IR8500 BGA Soldering rework Station Reballing Kit Motherboard Mobile Phone Chip Repairing Rework Machine IR6500 Updated ► Photo 1/6
LY IR8500 BGA Soldering rework Station Reballing Kit Motherboard Mobile Phone Chip Repairing Rework Machine IR6500 Updated ► Photo 1/6
LY IR8500 BGA Soldering rework Station Reballing Kit Motherboard Mobile Phone Chip Repairing Rework Machine IR6500 Updated ► Photo 2/6
LY IR8500 BGA Soldering rework Station Reballing Kit Motherboard Mobile Phone Chip Repairing Rework Machine IR6500 Updated ► Photo 3/6

Specifications

  • is_customized: No
  • Model Number: LY IR8500 rework station
  • Zones: 2
  • Heating: IR
  • Operations: Manual / Software
  • Dimension: L780mmx W450mmx H260mm
  • Weight: 21kg
  • Power: 220V AC
  • Upper Heating: IR
  • Size of Upper heating: 80mm x 80mm
  • Consumption of upper heating: 450W
  • Bottom Heating: IR
  • Size of Bottom heating: 400mm x200mm
  • Consumption of Bottom heating: 1600W
  • General power: 2050W

LY IR8500 BGA Soldering rework Station Reballing Kit Motherboard Mobile Phone Chip Repairing Rework Machine IR6500 Updated

Seller:
Alitools rating:
75%
/
Aliexpress rating:
100%
578.00 634.10 $
3   orders
/
1   reviews
Rating: 5

Price history

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