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Specifications
- Brand Name: NoEnName_Null
- Model Number: 138C/183C/217C
- Particle Size: 25-48μm
- Storage environment: room temperature/cold
- Suitable for1: For iphoneX Circuit Board P
- Suitable for2: Repair mainboard Location
- Type: For iphoneX Special solder paste
- Melting Point: 138/183/217
- DIY Type: Computer, Phone Chip Reballing
- 100%: High Quality
- Usage: PCB BGA Repairing Tool
- Features 1: High Viscosity No-clean Flux
- Features 2: Avoid the Pale Yellow Residue
- Drop Ship: Support
- Item Name: BGA Soldering Tin Cream
- weight: 35g/70g
- Ag: 3%-1%
- Cu: 0.5%
- Sn: 96.5%
- Conductivity: good
- Putter: 1/2
- Blade: 1
Lead-free solder paste maintenance soldering tin for BGA SMT PCB 138 183 217 degrees environmental protection tin mud CPU tin35g
1.97
–
10.26
$
13
orders
/
19
reviews
Price history
- for 3 month
- for half a year
- Requires Alitools extension
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Price drop notification
1.87 $ (-5%)
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1.77 $ (-10%)
1.67 $ (-15%)
1.58 $ (-20%)
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Customer Reviews
V***n
January 3, 2021
Very GOOD 5+
Z***a
January 2, 2021
It is very dry, so somewhat hard to handle, but once it is heated up it solders well.
Anonymous