Photos of buyers
Specifications
- Range of use: EMMC/EMCP/UFS Platform for
- BGA Model: BGA162/169/186/221/254
- Magnetic base: Precision positioning plat
- Mobile phone Maintenance: Professional mobile phone repair kit
- Multi-function product: High quality stee
- Operating Temperature: suitable for BGA153 A89 reballing cell
- Dissipation Power: Good
- Application: Mobile Phone eMMC eMCP BGA153
- Model Number: BGA reballing Stencil BGA153 189
- USE: BGA reballing Stencil BGA153 162 189
- Package: Case
- Brand Name: wozniak
- DIY Supplies: Metalworking
- Origin: CN(Origin)
- Model Number: EMMC EMCP UFS BGA 153 162 169 186 221 254
- Size: 10*10*3
- Type: BGA plant tin
- Application: Computer Tool Kit
EMMC EMCP UFS BGA 153 162 169 186 221 254 Universal Maintenance Platform Planting Tin Net Suit Chip Repair tools
4.80
–
33.80
$
21
orders
/
16
reviews
Price history
- for 3 month
- for half a year
- Requires Alitools extension
The Alitools extension is required to keep track of an item and receive notifications when prices drop.
Price drop notification
4.56 $ (-5%)
4.56 $ (-5%)
4.32 $ (-10%)
4.08 $ (-15%)
3.84 $ (-20%)
Out telegram bot will notify you once the price drops to the desirable one
This item is from other sellers
Similar Products
Customer Reviews
a***v
November 1, 2020
All OK! Very Good!
A***o
October 30, 2020
Very good. Thanks!
Anonymous