Photos of buyers
Specifications
- Model Number: Universail BGA Reballing Stencil
- Particle Size: 1-10μm
- Type: Reballing stencil
- Application:: BGA rework station accessory
- Function:: Reballing Assistant
- Design: with heat dissipating holes
- Thickness: 0.12mm
AMAOE Universail BGA Reballing Stencil 0.3 0.35 0.4 0.45mm Tin Mesh Solder Template for Phone BGA IC Chips Repair
6.58
$
27
orders
/
56
reviews
Price history
- for 3 month
- for half a year
- Requires Alitools extension
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Price drop notification
6.25 $ (-5%)
6.25 $ (-5%)
5.92 $ (-10%)
5.59 $ (-15%)
5.26 $ (-20%)
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