3D BGA Stencil A8 A9 A10 A11 A12 A13 For iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XR/XS/11/11Pro/MAX IC Solder Reball Tin Plant Net ► Photo 1/6
3D BGA Stencil A8 A9 A10 A11 A12 A13 For iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XR/XS/11/11Pro/MAX IC Solder Reball Tin Plant Net ► Photo 1/6
3D BGA Stencil A8 A9 A10 A11 A12 A13 For iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XR/XS/11/11Pro/MAX IC Solder Reball Tin Plant Net ► Photo 2/6
3D BGA Stencil A8 A9 A10 A11 A12 A13 For iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XR/XS/11/11Pro/MAX IC Solder Reball Tin Plant Net ► Photo 3/6

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Specifications

  • Origin: CN(Origin)
  • Model Number: mijing BGA Reballing Stencils
  • Particle Size: 1-10μm
  • Size:: 85mm*69mm
  • Application:: CPU BGA Reballing
  • Number of Pieces:: 1 piece
  • Combination:: For iPhone 6 6P 6S 6SP 7 7 8 8P X XS XR XS-Max 11proMAX

3D BGA Stencil A8 A9 A10 A11 A12 A13 For iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XR/XS/11/11Pro/MAX IC Solder Reball Tin Plant Net

Seller:
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11.89 11.98 $
42   orders
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17   reviews
Rating: 4.9

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