20g Leaded Solder Paste Flux Sn63/Pb37 Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair ► Photo 1/6

20g Leaded Solder Paste Flux Sn63/Pb37 Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair ► Photo 1/6

20g Leaded Solder Paste Flux Sn63/Pb37 Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair ► Photo 2/6

20g Leaded Solder Paste Flux Sn63/Pb37 Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair ► Photo 3/6

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Specifications

Model Number: Solder Paste
Particle Size: 25-48μm
Net Weight: 20g
Melting Point: 183℃
Style: Soldering Tin Paste
Usage: BGA Soldering Station Solder Paste Flux

Tools Welding & Soldering Supplies Welding Fluxes

20g Leaded Solder Paste Flux Sn63/Pb37 Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair

Alitools rating:

95%

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Aliexpress rating:

96%

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Reliable brands for sale.
The seller has been active on the platform for more than three years.
3% buyers are dissatisfied with products from the seller.
Buyers are satisfied with the seller's communication.
The products from the seller match their descriptions.
The seller ships quickly.

2.68 $

271 orders

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38 reviews

Rating: 4.8

Price history

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Customer Reviews

J***a

September 22, 2020

thank.