20g Leaded Solder Paste Flux Sn63/Pb37 Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair ► Photo 1/6

20g Leaded Solder Paste Flux Sn63/Pb37 Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair ► Photo 1/6

20g Leaded Solder Paste Flux Sn63/Pb37 Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair ► Photo 2/6

20g Leaded Solder Paste Flux Sn63/Pb37 Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair ► Photo 3/6

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Specifications

Model Number: Solder Paste
Particle Size: 25-48μm
Net Weight: 20g
Melting Point: 183℃
Style: Soldering Tin Paste
Usage: BGA Soldering Station Solder Paste Flux

Tools Welding & Soldering Supplies Welding Fluxes

20g Leaded Solder Paste Flux Sn63/Pb37 Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair

Alitools rating:

93%

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Aliexpress rating:

92%

Read reviews and get in touch with the seller. If everything looks good, proceed with the purchase.

Reliable brands for sale.
The seller has been active on the platform for more than three years.
4% buyers are dissatisfied with products from the seller.
Buyers are satisfied with the seller's communication.
The products from the seller match their descriptions.
The seller ships quickly.

2.68 $

480 orders

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69 reviews

Rating: 4.6

Price history

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Customer Reviews

J***a

September 22, 2020

thank.