Specifications
- Brand Name: XMSJ
- Origin: CN(Origin)
- Certification: NONE
- Model Number: sk-11
- Particle Size: 20-38μm
- Volume: 10CC
- Flux: NC-559-ASM
- Material: Lead Free Tin Solder Paste
- Application: for Phone BGA Reballing
- Packing: bag
- Design: Needle-Tube
- Usage: for Phone Welding Tool
- Feature 1: Lead Free, Environmental-Friendly
- Features 2: Transparent Residue, No Halogen
- Features 3: Low Solder Ball Rate
- Features 4: Excellent Wetting Ability On PCB
100% Original AMTECH NC-559-ASM BGA Soldering Tin Cream for Mobile Phone Motherboard Soldering Repair Tool
2.63
$
12
orders
/
3
reviews
Price history
- for 3 month
- for half a year
- Requires Alitools extension
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Price drop notification
2.50 $ (-5%)
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2.24 $ (-15%)
2.10 $ (-20%)
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